Advanced Packaging and the Future of Artificial Intelligence Artificial intelligence applications require immense computational power and rapid data processing capabilities. Traditional semiconductor architectures often struggle to meet these demands, leading manufacturers to adopt advanced packaging technologies such as 3D and 2.5D TSV interconnects. AI accelerators process enormous volumes of information simultaneously. To support this workload, chips must communicate efficiently with memory and other processing units. TSV-based packaging enables high-bandwidth connections that significantly improve data transfer rates. Source - https://www.marketresearchfuture.com/reports/3d-25d-tsv-interconnect-advanced-packaging-market-31944